Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on‑resistance and cost‑effectiveness. The D2PAK (TO‑263) is a surface mount power package capable of accommodating die sizes up to HEX‑4. It provides the highest power capability and the lowest possible on‑resistance in any existing surface mount package. The D2PAK (TO‑263) is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.
