Third Generation Power MOSFETs from Vishay provides the designer with the best combination of fast switching, ruggedized device design, low on‑resistance and cost effectiveness. The TO‑220 FULLPAK eliminates the need for additional insulating hardware in commercial‑industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heat sink. This isolation is equivalent to using a 100 micron mica barrier with standard TO‑220 product. The FULLPAK is mounted to a heat sink using a single clip or by a single screw fixing.
