Heat Sink Compound for Semiconductors

Did you know that whenever you install or replace a power semiconductor, you must also apply heat sink compound?

We recommend using Tech Spray 1978-DP for all isolated base encapsulated modules. Examples of this would be bridge rectifiers, IGBT modules, transistor modules, solid state relays, power modules, and et ceteras. Any isolated base device that is being mounted to a metal surface for heat dissipation needs 1978-DP from Tech Spray.

We also recommend using Burndy Penetrox PENA138. PENETROX™ oxide‑inhibiting compounds produce low initial contact resistance, seal out air and moisture, prevent oxidation or corrosion, exhibit superior weathering characteristics, are usable over wide temperature ranges, and provide a high conductivity "gastight" joint. All PENETROX™ compounds contain homogeneously suspended metal particles. The suspended metal particles assist in penetrating thin oxide films, act as electrical "bridges" between conductor strands, aid in gripping the conductor, improve electrical conductivity and enhance the integrity of the connection. The specially formulated PENETROX™ compounds are for use with compression and bolted connectors providing an improved service life for both copper and aluminum connections. Additionally, the non‑toxic compounds are an excellent lubricant for threaded applications reducing galling and seizing.

Using the right compound will help prolong the life of the device. Without compound the device will develop hot spots within itself and cause premature failure. Compare this to running a car engine without oil, and guess what will happen!

Make sure you order compound the next time you place an order for a semiconductor device.

For further assistance, call a Galco Sales Representative today at